All Torex IC's are 100% compliant with RoHS (Restriction of Hazardous Substances) standards. All of the company's Integrated Circuits meet the RoHS proposed thresholds for cadmium, mercury, lead, hexavalent chromium, polybrominated biphenyls (PBBs) and polybrominated diphpenyl ethers (PBDEs).
In order to meet the RoHS standard, each package component (mold compound, lead frame, etc.) must be within the RoHS thresholds shown below:
RoHS Threshold (ppm) RoHS Threshold (% of wt.)
Lead 1000ppm 0.1%
Mercury 1000ppm 0.1%
Cadmium 100ppm 0.01%
Hexavalent Chromium 1000ppm 0.1%
Polybrominated Biphenyls (PBB) 1000ppm 0.1%
Polybrominated Diphenyl Ethers (PBDE) 1000ppm 0.1%
Bis(2-ethylhexyl) phthalate (DEHP) 1000ppm 0.1%
Butyl benzyl phthalate (BBP) 1000ppm 0.1%
Dibutyl phthalate (DBP) 1000ppm 0.1%
Diisobutyl phthalate (DIBP) 1000ppm 0.1%
* Lead is allowed up to 4% as an alloying agent in copper-based alloys such as leadframes.
The peak reflow soldering temperature of the lead-free part is 10°C higher than standard reflow peak temperature. In order to guarantee reliable assembly, Torex has followed the strict guidelines of the IPC/JEDEC specification J-STD-020C. To determine the Moisture Sensitivity Level (MSL) of a Torex IC, please consult the Reliability Test Data for each product family which can be downloaded from this website by accessing the individual product pages. The MSL level is shown in the Reliability Test Data under ‘Resistance to Soldering Heat’.